The Nº.4 Bond Maintenance Shampoo, infused with patented OLAPLEX Bond Building Technology, is a highly concentrated reparative shampoo that hydrates and nourishes hair. Ingredients: Water, Sodium Lauroyl Methyl Isethionate, Cocamidopropyl Hydroxysultaine, Potassium Cocoyl Glycinate, Disodium Cocoyl Glutamate, Potassium Cocoate, Sodium Lauroyl Sarcosinate, Glycereth-26, Decyl Glucoside, Fragrance, Phenoxyethanol, Cocamidopropylamine Oxide, Sodium Cocoyl Glutamate, Glycol Distearate, Disodium Laureth Sulfosuccinate, Methyl Gluceth-20, Acrylates Copolymer, PEG-120 Methyl Glucose Dioleate, Amodimethicone, Polyquaternium-10, Citric Acid, Ethylhexylglycerin, Sodium Lauryl Sulfoacetate, Divinyldimethicone/Dimethicone Copolymer, Chlorphenesin, Polyquaternium-11, Guar Hydroxypropyltrimonium Chloride, C11-15 Pareth-7, Trisodium Ethylenediamine Disuccinate, Laureth-9, Glycerin, Trideceth-12, Panthenol, Hydrolyzed Vegetable Protein PG-Propyl Silanetriol, C12-13 Pareth-3, C12-13 Pareth-23, Helianthus Annuus (Sunflower) Seed Oil, Tocopherol, Pseudozyma Epicola/Camellia Sinensis Seed Oil Ferment Extract Filtrate, Pseudozyma Epicola/Argania Spinosa Kernel Oil, Ferment Filtrate, Prunus Armeniaca (Apricot) Kernel Oil, Quaternium-95, Propanediol, Helianthus Annuus (Sunflower) Seed Extract, PEG-8, Bis-Aminopropyl Diglycol Dimaleate, Euterpe Oleracea Fruit Extract, Rosmarinus Officinalis (Rosemary) Leaf Extract, Punica Granatum Extract, Origanum Vulgare Leaf Extract, Musa Sapientum (Banana) Fruit Extract, Morinda Citrifolia Fruit Extract, Sodium Hyaluronate, PEG-8/Smdi Copolymer, Arctium Lappa Root Extract, Sodium Polyacrylate, Palmitoyl Myristyl Serinate, Citral, Hexyl Cinnamal, Limonene, Biotin, Pentaerythrityl Tetra-Di-T-Butyl Hydroxyhydrocinnamate.